commonly used in rigid flex circuits

Rigid-Flex Circuits are made by laminating together rigid and flexible substrates, allowing you to design a printed circuit board that has the strength of a rigid PCB with the dynamic adaptability of a flex PCB. Rigid flex circuits are used in a variety of applications, including consumer electronics and automotive components. The flexibility of these circuits helps to increase connection density and reduce overall system weight. Rigid-flex circuits are also ideal for use in applications that require a high degree of bending, vibration and shock resistance.

The conductor material in a flex circuit is copper foil, and the thickness of this foil can vary significantly. Copper can be electrodeposited or rolled and annealed, and both types have advantages over the other for certain applications. The copper foil is typically subjected to surface treatment before it is bonded to the flex dielectric in a flex circuit, which can enhance its adhesion, reduce bond degradation and prevent oxidation.

There are a variety of different types of adhesives that can be used in the fabrication of a rigid flex circuits, but the most popular is an epoxy-based adhesive film called a prepreg. Unlike most PCB glues, prepreg adhesives are cured by heat and pressure. This process results in a high-strength, durable, thermosetting adhesive film that is extremely resistant to a wide range of temperatures and chemicals.

What materials are commonly used in rigid flex circuits?

The insulator or dielectric layer in a flex circuit is usually a polyimide film, but other materials can be used, such as FR-4. Polyimide films have excellent thermal and chemical properties, and they are often chosen for flex applications due to their low coefficient of expansion in the reflow process. The insulator layer can be a single layer or multiple layers, depending on the flex circuit’s requirements.

Coverlays and bondpiles are other forms of insulator that can be used in the construction of a rigid-flex circuit. A coverlay is a rigid layer that insulates the flex circuitry on surfaces and prevents it from lifting during assembly. A bondpile is similar to a coverlay, but it is used on the inner stripline layers of the flex circuit and serves to glue two flex cores together.

Once the insulator and conductor layers have been assembled, holes are drilled into each layer to connect the different sections of the flex circuit. These holes are then plated with copper to ensure a solid and stable electrical connection between the layers of the circuit. Finally, the conductive paths are sealed with solder mask to protect them from corrosion and oxidation.

Rigid-flex circuits can be challenging to design, but they provide a great deal of functionality and versatility. Working with an experienced, qualified PCB manufacturing company will help you create a rigid-flex circuit that meets your project’s specific needs. They will be able to advise you on the best materials for your circuit and the assembly processes that will give it the best possible performance. Contact your PCB manufacturing partner today to get started.